Item	Technical Capacity
	Mass Production (MP)	Sample(the type of PCB we can produce)
Types of Products	HDI Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board， Flex-Rigid PCB, and FPC	HDI Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base， Board Flex-Rigid PCB，FPC, Teflon Board
Material	FR-4,Aluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3	FR-4,Aluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon
layers	2-32 Layers	2-32 Layers
Conductor Width/ Space of the Inner Layer	3/3mil	3/3mil
Conductor Width/ Space of the Outlayer Layer	3/3mil	3/3mil ,2/2 mil for FPC
Board Width of the Inner Layer	0.1-1.6mm	0.075-1.6mm
Hole Diameter	0.2mm	0.15mm
Ratio of Depth against Diameter	8:1	10:1
Maximum Dimension	630*530mm	630*530mm
Interior Copper Width	18-140um	18-210um
Exterior Copper Width	12-210um	12-210um
Minimum Width of the Welding Ring	0.13mm	0.10mm
Minimum Width of Bridge with Solder Mask	0.08mm	0.05mm
Minimum Solder Resist Window	0.05mm	0.03mm
Tolerance of Solder Resistance	±10%	±8%
Board Thickness	0.15mm～3.4mm	0.15mm～3.4mm
Outline Process Precision	±0.1mm	±0.08mm
Surface Treatment	HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger	HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP